Pembekal Peralatan Semikonduktor | Pengikat Wayar

Semiconductor Manufacturing & Packaging Equipment

HYRNUS provides semiconductor manufacturing, packaging and testing equipment for research, pilot production and mass-production applications. Our equipment portfolio covers multiple processes from wafer preparation and die attachment to wire bonding, molding, inspection, testing and final sorting.

Mesin Ikatan Bola Pengikat Wayar Emas
Pengikat Wayar Bebola Emas HY-GB2012 terutamanya digunakan untuk pengikatan plumbum dalaman LED berkuasa tinggi, diod laser, diod kuasa kecil dan sederhana, transistor, litar bersepadu, sensor dan peranti semikonduktor khas. Ia amat sesuai untuk pengikatan wayar peranti LED berkuasa tinggi.
BACA LAGI
Mesin Ikatan Wayar Ultrasonik Untuk Makmal
Pengikat dawai ultrasonik HY-WB2000 menggunakan dawai aluminium halus, tekanan dan tenaga ultrasonik untuk mewujudkan sambungan elektrik yang boleh dipercayai antara cip dan substrat. Ia sesuai untuk peranti gelombang mikro, modul RF, litar hibrid, MEMS, peranti optoelektronik, sensor, peranti semikonduktor, peranti radar, pembungkusan COB/SOB dan aplikasi mikroelektronik yang lain.
BACA LAGI

One-Stop Semiconductor Equipment Solutions

In addition to standalone semiconductor equipment, HYRNUS provides equipment configuration and integrated production line solutions for semiconductor manufacturing and electronic component packaging.

Get A custom solution

01 Production Line Planning

Plan the production process, equipment layout, material flow and workstation configuration based on the available factory space, target capacity and automation requirements.

02 Process Solution Development

Develop a suitable process flow according to the device type, package structure, materials and manufacturing requirements, covering key processes such as die attach, wire bonding, molding, inspection, testing and sorting.

03 Equipment Selection and Configuration

Select and configure suitable machines based on production capacity, material compatibility, positioning accuracy, process control, automation level and data traceability requirements.

Semiconductor packaging production line

Produk

01

Production Line Planning

02

Process Solution Development

03

Equipment Selection and Configuration